New Advances in Interconnect Technology

Mundt & Associates, Inc. Introduces the New Model IB-1284 Laser Bonder

The established bonding standards such as ultrasonic bonder, parallel gap welders and solder work well, but there are existing problems with these technologies that can now be reduced.

The new technology of laser bonding can bring products into production with fewer problems, more design options and a larger process window.

Manufacturers of implantable devices are advanced and on the cutting edge of technology with reliability being paramount. A manufacturer of implantable medical apparatuses has been running production for the last five years using multiple IB-1284 Laser Bonding Machines.

The IB-1284 was developed to improve interconnect technology for high reliability industries.

Comparison Technologies

ULTRASONIC BONDING

Ultrasonic bonders have been around for years, and for that entire time engineers have been designing around the shortcomings of this process. Until now there have been no alternatives. Many of the defects of ultrasonic bonding have been revised with the new laser bonding.

BOND RELIABILITY

Ultrasonic bond depths are in the order of angstroms. With the IB-1284 laser bonder, the bonds are actually welds with controllable bond depths which range from sub-micron to mils, depending on what the process requires.

BOND FORCE

The IB-1284 technology laser bond forces are very low. Enough momentum is required to provide intimate contact between the ribbon or wire and the pad that it is being bonded to. These forces are substantially less than those used with an ultrasonic bonder.

The technology developed for laser bonding has opened new windows for design engineers.

NON-RIGID BOND PADS

The IB-1284 laser process does not depend on vibration to make the adhesion, so bonds can be made to pads that are not rigid.

FRAGILE COMPONENTS

Fragile components cannot withstand the vibration produced during an ultrasonic bond. With the laser bond process there is no pulsation and bond forces are very low. This minimizes damage to very fragile elements, thus expanding the range of components and materials that can be bonded.

TAB WELDS

Resistance tab welding has been used for many years and the problems are well-known. The laser beam used for laser welding will not become dirty, so welds are consistent from the first to the last. With the IB-1284 laser bond system tabs can be welded to provide interconnects, which use flex circuits or other preforms. Weld forces are lower than resistance welders, allowing for the fusion of fragile components.

This advanced technology helps eliminate RoHS compliance issues.

SOLDERING

Europe’s RoHS specifications and requirements have developed new problems for the soldering process. In some applications, the IB-1284 has eliminated these new problems by replacing solder with laser welds.

If an application requests that soldering be used, the IB-1284 can easily re-flow solder to provide very precise and controlled heat, yielding consistent adhesive joints.

Prior to the development of the IB-1284, there were difficulties with other bond technologies. Some manufacturers are still dealing with these same

Laser bonding designs can improve your product performance, product yield, and overall product reliability.

problems today, which results in limited design parameters and low yields. Now design options are greater and product outputs are higher.